Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Products
XianYi is a leading manufacturer and supplier of electronic packaging interconnection materials in China, providing highly reliable electronic packaging solutions. Dedicated to aerospace, microwave&RF, laser ,IR, optical communication, power electronics and other fields to provide Solder Preforms, AuSn Solder Paste, AuSn Solder Seal Lids, AuSn Thin Film Heat Sink, Nano-Ag Paste and AMB Ceramic Substrates and other products.
Interconnecting Materials for Electronic Packaging
Solder Preforms
Over a hundred kinds of solder alloys (Au80Sn20, Au88Ge12, etc) available.
AuSn Solder Paste.
Company Vision
Leading brand of semiconductor microassembly interconnecting materials.
We aim to becoming the integrated service provider of microelectronic packaging and semiconductor devices based on key materials, energizing semiconductor interconnections.
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
AMB Ceramic Substrates
Nano-Ag Paste
AuSn Solder Paste
AuSn Solder Seal Lids
●Six-sided electroplating, salt spray resistance over 24h
●Precise tacking
●Small solder joint, no oxidation or breakdown.
●High gas tightness, high corrosion resistance and high reliability
●Independent production in whole process including lid forming,
lid electroplating, solder preform forming and precise tacking
AuSn Thin Film Heat Sinks
●2~10 μm AuSn solder layer deposited by PVD method
●Alloy film with good solderability
●End products and AuSn coating processing services available
●Possessing process capability of thin film circuit manufacturing
including lithography, deposition and scribing
AMB Ceramic Substrates
●Self-developed active brazing material
●Whole process flow self-controlled
●Ultra-low interface void, high thermal conductivity
●Excellent temperature shock resistant, high reliability
Nano-Ag Paste
●Self-developed nano-Ag dispersing system, RoHS compliant
●Pressureless or pressure-assisted sintering
●Low sintering temperature and high working temperature
●High connecting strength, excellent electrical and thermal conductivity
●Alternative to high-lead solder
●No organic residue, cleaning free
AuSn Solder Paste
●Excellent wettability, high corrosion and oxidation resistance
●Easy to clean after soldering
●Good sphericity
●Fast delivery, 1 week delivery
●Long shelf life, 6 months
About Us
Manufacturer of Advanced Semiconductor Connecting Materials
Providing technical consulting service and solutions
Founded in December 2008，Guangzhou XianYi Electronic Technology Co., Ltd.,is a national high-tech enterprise integrating R&D, production and sales of advanced packaging and connecting materials, and a well-known domestic micro-assembly material solution provider.
16
years
experience
5
management systems
60
+
patented technologies
10000
+
sets of molds
1000
+
customers
Qualification&Honor
State-Level National High-Tech and New-Tech Enterprises
State-level Technologically Advanced "Little Giants" Enterprises
Engineering Research Center of Guangdong Province
GB/T 19001-2016 idt ISO 9001:2015 Quality Management System
GB/T 19001-2016 idt ISO 9001:2015 Environmental Management System
IATF16949 Automotive Quality Management System
GB/T29490 Enterprise intellectual property management
WeChat Official Accounts
Hotline
020-34698382
Email：info@xianyichina.com
Guangzhou Xianyi Electronic Technology Co., Ltd.
Address：3/F, Building5& 6, 16 Lianyun 1st heng Road, Shiqi Town, Panyu District, Guangzhou, Guangdong, China